Power Electronics Design Fundamentals - Multiphysics approach for Cooling, EMI, Thermal Design, Wide Bandgap DevicesSee upcoming dates
Power electronics connects four subfields: electronics, magnetics, energy conversion and control systems. Using applications, examples and hands-on demonstrations, you will learn the basics and nuances.
- Appliance power supplies
- Cranes and elevators
- Precision motion control
- Renewable/alternative energy
- Electric/hybrid-electric vehicles
- Autonomous vehicle control
- Smart distribution systems
- Flexible AC Transmission Systems (FACTS)
Review of diodes, semiconductors, fundamentals of power electronics
Buck converter quick demo
Single-phase inverters and modulation
Three-phase inverters and modulation
Gate drives and sensors
Cooling, layout, and EMI considerations
DC bus design considerations
Thermal design of power electronics
Reliability of power electronics
New power semiconductor switches - SiC and GaN
Michael Ryan received his B.S. in Electrical Engineering from the University of Connecticut, Storrs,1988, M.E. degree in Electrical Engineering from Rensselaer Polytechnic Institute, Troy, NY, 1992, and Ph.D. in Electrical Engineering from the University of Wisconsin-Madison, 1997. At UW-Madison, Ryan worked in the WEMPEC labs on projects including dc–dc converters, variable-speed generation systems, and UPS inverter control.
Ryan is President of Ryan Consulting, involved in the application of Power Electronics and Controls, particularly for Alternative Energy systems. He has held prior positions at Capstone Turbine, General Electric Corporate Research and Development and Defense Systems divisions, Automated Dynamics, Otis Elevator, and Hamilton Standard.
Professor, Department of Electrical and Computer Engineering, University of Wisconsin-Madison
Thomas M. Jahns is a Professor with the Department of Electrical and Computer Engineering at the University of Wisconsin–Madison. Previously with GE Corporate R&D and Massachusetts Institute of Technology, Jahns has research interests in electric machines, drive system analysis and control, and power electronic modules.
F. Patrick McCluskey
Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Department’s Design and Systems Reliability Division Leader. He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications. Dr. McCluskey has published three books and over 150 peer-reviewed technical articles with over 2500 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, a member of the board of governors of the IEEE Electronic Packaging Society, a fellow of IMAPS and a member of ASME and AIAA.
Bulent Sarlioglu is a Jean van Bladel Associate Professor at University of Wisconsin–Madison, and Associate Director, Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC). Dr. Sarlioglu spent more than ten years at Honeywell International Inc.’s aerospace division, most recently as a staff system engineer, earning Honeywell’s technical achievement award in 2003 and an outstanding engineer award in 2011. Dr. Sarlioglu contributed to multiple programs where high-speed electric machines and drives are used mainly for aerospace and ground vehicle applications. Dr. Sarlioglu is the inventor or co-inventor of 20 US patents and many other international patents. He published more than 200 journal and conference papers with his students. His research areas are motors and drives including high-speed electric machines, novel electric machines, and application of wide bandgap devices to power electronics to increase efficiency and power density. He received the NSF CAREER Award in 2016 and the 4th Grand Nagamori Award from Nagamori Foundation, Japan in 2019. Dr. Sarlioglu became IEEE IAS Distinguished Lecturer in 2018. He was the technical program co-chair for ECCE 2019 and was the general chair for ITEC 2018. He is serving as a special session co-chair for ECCE 2020.
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Power Electronics Design Fundamentals - Multiphysics approach for Cooling, EMI, Thermal Design, Wide Bandgap DevicesCourse #: RA01185
Introduction to Power ElectronicsDate: Mon. October 28, 2019 – Wed. October 30, 2019
Fee covers morning and afternoon breaks, scheduled lunches, and course materials
- CEU: 2
- PDH: 20
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