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Engineering Professional Development

Power Electronics Design Boot Camp Electrical, Thermal, EMI, Reliability, and New Devices

epd.wisc.edu/RA01448 See upcoming dates

Course Overview

You will learn to master critical subjects for effective design of power electronics, like EMI/EMC, thermal, and reliability design and selection. Expert instructors in the field will teach you to analyze and control power electronic design. They will also expose you to new power electronic devices like Silicon Carbide (SiC) and Gallium Nitride (GaN) devices.

Who Should Attend?

This course will benefit persons working in the area of power electronics design, research, and development such as:

  • Electrical engineers 
  • Mechanical engineers 
  • System engineers
  • Program managers
  • Project engineers 
  • Technical leaders
  • System integrators

Participants should already have some basic acquaintance with power electronics fundamentals and will stress intermediate to advanced subjects. You should have a bachelor’s degree in engineering or a related science or the equivalent amount of industrial experience.

Course Outline

Review of Most Commonly Used Power

Electronic Topologies

  • AC-DC, DC-AC, and DC-DC converters
  • Pulse with modulation

Power MOSFET Devices and Applications

  • Device structure: planar, trench, lateral, superjunction
  • FET characteristics – interpreting a datasheet
  • Thermal instability and hot-spotting in power devices (the Spirito effect)
  • Switching characteristics, hard- and soft-switching
  • FET body-diode characteristics, limits, and failure modes
  • Package electrical and thermal characteristics
  • Thermal models and transient thermal impedance
  • Parallel operation of FETs – static and dynamic current sharing
  • Safe Operating Area (SOA) – forward and reverse bias

IGBT Devices and Applications

  • Device structure: PT, NPT, FS, co-pack diode
  • IGBT characteristics – interpreting a datasheet
  • Current handling and short-circuit capability
  • Safe Operating Area (SOA) – forward and reverse bias, avalanche
  • Switching characteristics – hard- and soft-switching
  • IGBT packaging
  • Thermal impedance and models – IGBT and diode
  • Parallel operation of IGBTs – static and dynamic current sharing
  • Short circuit protection in inverters

Gate Drives

  • Parasitic impedance effects in fast-switching circuits
  • How common source inductance affects switching behavior
  • Inductively-limited switching and di/dt limits
  • Using the Kelvin Source connection in gate drive circuits
  • How much gate drive current and power is necessary?

Fundamentals of Capacitors in Power Electronic Circuits

  • The four basic types their application spaces
  • Sizing capacitors for a two-level VSI and a boost converter
  • Techniques for capacitor integration/packaging

PCB Layout Effects

  • Parasitic impedance, common-source inductance
  • Capacitive coupling examples
  • Inductive coupling examples

Wide Bandgap Power Devices (GaN and SiC) and Converters

  • Comparing normally-on and normally-off device characteristics
  • Static and dynamic characteristics and temperature dependencies
  • Out charge Qoss – why a single number doesn’t tell the whole story
  • Reverse conduction: cascade diode characteristics vs. HEMT diode-like behavior
  • Interpreting double-pulse test results – capacitive charge versus true reverse-recovery
  • Voltage ratings: overvoltage, breakdown
  • Safe operating area and short-circuit capability
  • Thermal characteristics, models
  • Packaging considerations and parasitic impedances

Power Electronic Converter Design with SiC and GaN Devices

  • Efficiency calculations
  • Comparison with Si converters

Thermal Engineering Practice for Power Electronics

  • Conduction and switching loss measurements and calculations
  • Thermal impedance matrices and measurement techniques
  • Transient thermal impedance and device thermodynamic models
  • Basic properties of air and liquid heat exchanges

Reliability Engineering for Power Electronics

  • Basic Weibull analysis
  • Wearout mechanisms: cyclical fatigue and Arrhenius
  • Power transistor and capacitor reliability calculations

Insulation and Dielectric Design

  • Creepage and clearance
  • Breakdown of air/gasses
  • Corona and partial discharge
  • Insulation thermal life and testing

Control and Dynamics

  • Forward dynamics and disturbance rejection in power electronics
  • Linear operating point models
  • Power converter dynamics and state space averaging

EMI for Power Electronics

  • EMI requirements, testing, and test setups
  • Analysis of power electronic emissions
  • Mitigation of power electronics emissions

Converter/Inverter PWM Modulators

  • Differential mode characteristics
  • Common mode characteristics

System Issues Excited by AC Drive CM and DM Voltages

  • Motor over-voltages
  • Bearing damage

Effect of High Frequency CM and DM on Application Hardware

  • Sensors
  • Plant equipment/protection
  • Mitigation

Effect of High Frequency CM and DM on Control/Protection Components

  • Drive sensor characteristics
  • Current sensing

Influence of High Frequency on Power Device Switching Dynamics

  • IGBT behavior
  • Performance and mitigation
  • Voltage measurement/observers

Upcoming dates (1)